Spesifikasi HMD Fusion




Network
TechnologyGSM / HSPA / LTE / 5G
2G bandsGSM 850 / 900 / 1800 / 1900
3G bandsHSDPA 850 / 900 / 1700(AWS) / 1900 / 2100
4G bands1, 3, 5, 7, 8, 20, 28, 32, 38, 40, 41 - International
 2, 4, 5, 7, 8, 12, 13, 25, 26, 28, 41, 66, 71 - USA
5G bands1, 3, 5, 7, 8, 20, 26, 28, 38, 40, 41, 77, 78 SA/NSA/Sub6 - International
 2, 4, 5, 7, 25, 41, 66, 71, 77, 78 SA/NSA/Sub6 - USA
SpeedHSPA, LTE, 5G
Launch
Announced2024, September 05
StatusComing soon. Exp. release 2024, September
Body
Dimensions164.2 x 75.5 x 8.3 mm (6.46 x 2.97 x 0.33 in)
Weight202.5 g (7.16 oz)
BuildGlass front, plastic frame, plastic back
SIMNano-SIM, eSIM or Hybrid Dual SIM (Nano-SIM, dual stand-by)
 IP54, dust and splash resistant
HMD Fusion toolkit: CAD file and API access for building your own outfits
Repair-it-yourself capable (display, back cover, battery and charging port repairs)
Display
TypeIPS LCD, 90Hz, 480 nits (typ), 600 nits (peak)
Size6.56 inches, 103.4 cm2 (~83.4% screen-to-body ratio)
Resolution720 x 1612 pixels, 20:9 ratio (~269 ppi density)
Platform
OSAndroid 14, up to 2 major Android upgrades
ChipsetQualcomm SM4450 Snapdragon 4 Gen 2 (4 nm)
CPUOcta-core (2x2.2 GHz Cortex-A78 & 6x2.0 GHz Cortex-A55)
GPUAdreno 613
Memory
Card slotmicroSDXC (uses shared SIM slot)
Internal128GB 4GB RAM, 128GB 6GB RAM, 256GB 8GB RAM
Main Camera
Dual108 MP, (wide), AF 2 MP, (depth)
FeaturesLED flash, HDR
Video1080p@30fps, gyro-EIS
Selfie Camera
Single50 MP
VideoYes
Sound
LoudspeakerYes
3.5mm jackYes
Comms
WLANWi-Fi 802.11 a/b/g/n/ac/6
Bluetooth5.1, A2DP, LE, aptX Adaptive
PositioningGPS, GALILEO, GLONASS, BDS
NFCYes
RadioUnspecified
USBUSB Type-C 2.0, OTG, magnetic accessory connector pins
Features
SensorsFingerprint (side-mounted), accelerometer, gyro, proximity, compass
Battery
Type5000 mAh, non-removable, user replaceable
Charging33W wired, PD, QC
Misc
ColorsNoir
PriceAbout 250 EUR


HandPhone Trending